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中文
Research on the Ultra⁃wideband Interconnection Technology for 3D⁃SiP Module
LYU Jiaran, KAN Yao, LIU Shijie, XU Mengyuan, TANG Juntan, CHENG Haifeng
RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS . 2025, (
2
): 0 . DOI: 10.12450/j.gtdzx.202502007
