Experimental Study on Thermal Characteristics of GaN HEMT Device Using Diamond‑aluminum Composite Materials

SHI Shang

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (6) : 543-546.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (6) : 543-546.
Material & Technology

Experimental Study on Thermal Characteristics of GaN HEMT Device Using Diamond‑aluminum Composite Materials

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 43(6): 543-546

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