A Wafer-level Packaged MEMS Digital Attenuator

SUN Junfeng, JIANG Lili, LIU Shuiping, YU Yuanwei, ZHU Jian, LI Ming, CHEN Zhangyu

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (4) : 353-358.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (4) : 353-358.
Micro?nano Technology

A Wafer-level Packaged MEMS Digital Attenuator

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 43(4): 353-358

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