Development of a Metal Package for High‑power Phased‑array Antenna‑in‑package Application

DU Ming

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (3) : 272-276.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (3) : 272-276.
Material & Technologys

Development of a Metal Package for High‑power Phased‑array Antenna‑in‑package Application

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 43(3): 272-276

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