Co‑simulation of Signal / Power Integrity for High‑speed I/O Link Based on 2.5D Package

SUN Liang

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (3) : 234-240.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2023, Vol. 43 ›› Issue (3) : 234-240.
RF & Microwave & Terahertz

Co‑simulation of Signal / Power Integrity for High‑speed I/O Link Based on 2.5D Package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 43(3): 234-240

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