Research on SiP Module Junction Temperature Prediction Method under Forced Air-cooling Environment

WANG Xiwen, PEI Xiaofang, SUN Tingxiao, SHENG Shiqi, ZHANG Qi

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (5) : 417-421.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (5) : 417-421.
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Research on SiP Module Junction Temperature Prediction Method under Forced Air-cooling Environment

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 42(5): 417-421

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