Three-dimensional Integrated Ka-band Feed Network Based on Microwave Multilayer Board

WANG Jie, LI Jiao, YAN Chuan, CHU Hongjun

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (4) : 275-280.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (4) : 275-280.
RF & Microwave & Terahertz

Three-dimensional Integrated Ka-band Feed Network Based on Microwave Multilayer Board

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 42(4): 275-280

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