Research on X-band Down-conversion Module Circuit Based on 3D Integration Technology

LI Yukun, QIAN Xingcheng, PAN Bei, GE Zhenting, SONG Junxin

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (2) : 124-129.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (2) : 124-129.
RF & Microwave & Terahertz

Research on X-band Down-conversion Module Circuit Based on 3D Integration Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 42(2): 124-129

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