Failure Analysis of Metal Interconnection of Silicon-based Heterogeneous Integrated Modules

SONG Mingxuan, LIN Gang, LIU Pengfei, ZHANG Hongze

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (1) : 68-72.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2022, Vol. 42 ›› Issue (1) : 68-72.
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Failure Analysis of Metal Interconnection of Silicon-based Heterogeneous Integrated Modules

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 42(1): 68-72

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