Simulation and Fabrication of 3D Inductors Based on Glass Substrate

WANG Lei, HUI Keqing, XUE Kai, JIANG Feng, YU Daquan

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (6) : 419-424.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (6) : 419-424.
3D Integrated RF Microsystem

Simulation and Fabrication of 3D Inductors Based on Glass Substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(6): 419-424

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