Simulation Research on Electromigration Failure of Flip Chip Packages

MENG Yuan, CAI Zhikuang, XU Binbin, WANG Zixuan, SUN Haiyan, GUO Yufeng

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (5) : 399-404.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (5) : 399-404.
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Simulation Research on Electromigration Failure of Flip Chip Packages

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(5): 399-404

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