Au-Sn and Au-In Wafer Level Bonding for Heterogeneous Integration

WU Yan, LIU Pengfei, JIANG Lili

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (4) : 246-250.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (4) : 246-250.
3D Integrated RF Microsystem

Au-Sn and Au-In Wafer Level Bonding for Heterogeneous Integration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(4): 246-250

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