Study on Effect of Various Additives and Current Density on TSV Electroplating with Depth-width Ratio

LI Jie, WANG Lei, JIANG Lili, HUANG Min, YU Yuanwei, ZHANG Hongze, CHEN Cong

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (3) : 166-170.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (3) : 166-170.
3D Integrated RF Microsystem

Study on Effect of Various Additives and Current Density on TSV Electroplating with Depth-width Ratio

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(3): 166-170

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