Technology of 3D System-in-package with Stacked Substrates

PANG Xueman, ZHOU Jun, LIANG Qiushi, LIU Shichao

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (3) : 161-165.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (3) : 161-165.
3D Integrated RF Microsystem

Technology of 3D System-in-package with Stacked Substrates

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(3): 161-165

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