Fabrication and Characterization of Micro-bumps for Interconnection of Different Body Chips

CHEN Cong, LI Jie, JIANG Lili, WU Jing, ZHANG Yan, YU Yuanwei, HUANG Min, ZHU Jian

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (2) : 87-92.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (2) : 87-92.
3D Integrated RF Microsystem

Fabrication and Characterization of Micro-bumps for Interconnection of Different Body Chips

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(2): 87-92

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