PDF(1397 KB)
Research on Fine Pitch Cu/Sn Bump Flip-chip Interconnect Process for 3D Integration
HUANG Hongjuan, ZHAO Desheng, GONG Yafei, ZHANG Xiaodong, SHI Wenhua, ZHANG Baoshun
RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (2) : 81-86.
PDF(1397 KB)
PDF(1397 KB)
Research on Fine Pitch Cu/Sn Bump Flip-chip Interconnect Process for 3D Integration
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