Research on Packaging Structure of Silicon-based Microwave and Millimeter Wave Transceiver Chip

LIANG Haochen, QIAN Feng, SHEN Hongchang, XU Yang

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (2) : 132-136.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (2) : 132-136.
RF & Microwave & Terahertz

Research on Packaging Structure of Silicon-based Microwave and Millimeter Wave Transceiver Chip

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(2): 132-136

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