Low-temperature Sintering Silver Joining Process of Thermal Conductive Diamond and Large-size Chip

ZHAO Kechen, ZHAO Jiwen, DAI Bing, ZHANG Xu, GUO Huaixin, SUN Huarui, ZHU Jiaqi

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (1) : 65-68.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (1) : 65-68.
Material & Technologys

Low-temperature Sintering Silver Joining Process of Thermal Conductive Diamond and Large-size Chip

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(1): 65-68

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