Study of GaAs/Si Wafer Bonding Deviation and Effect Factors

GUO Huaixin, DIA Jiayun, PAN Bin, ZHOU Shutong, KONG Yuechan, CHEN Tangsheng, ZHU Jian

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (1) : 10-13.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2021, Vol. 41 ›› Issue (1) : 10-13.
3D Integrated RF Microsystem

Study of GaAs/Si Wafer Bonding Deviation and Effect Factors

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 41(1): 10-13

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