Grounding Failure Analysis on Through Silicon Via in the Assembly Process of MEMS Filters

WU Jing, LIU Mei, YU Miao, HU Yuhua, DU Guoping

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2020, Vol. 40 ›› Issue (4) : 296-299.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2020, Vol. 40 ›› Issue (4) : 296-299.
Micro-nano Technology

Grounding Failure Analysis on Through Silicon Via in the Assembly Process of MEMS Filters

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 40(4): 296-299

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