A Stacked Chip Junction Temperature Prediction Model Based on Thermal Resistance Network

ZHANG Qi, Cai Zhikuang, Wang Zixuan, Sun Haiyan, Guo Yufeng

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2020, Vol. 40 ›› Issue (1) : 66-70.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2020, Vol. 40 ›› Issue (1) : 66-70.
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A Stacked Chip Junction Temperature Prediction Model Based on Thermal Resistance Network

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 40(1): 66-70

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