Research Progress of Diamond Near‑junction Integrated Thermal Management for GaN Devices

GUO Huaixin, CHEN Tangsheng, KONG Yuechan, LI Zhonghui, LI Yizhuang, HUANG Jian

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (6) : 561-567.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (6) : 561-567. DOI: 10.12450/j.gtdzx.202406008
Carbon-based Electronic Devices & Applications

Research Progress of Diamond Near‑junction Integrated Thermal Management for GaN Devices

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(6): 561-567 https://doi.org/10.12450/j.gtdzx.202406008

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