Design and Process Study of Electrostatic Torsion Micromirror Based on Au/In Bonding

WANG Junduo, HU Yuwei, WU Yongqiang, SHAN Yameng, QIAN Lei, SHEN Wenjiang

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (3) : 252-257.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (3) : 252-257. DOI: 10.12450/j.gtdzx.202403012
Microelectronics & Microsystems

Design and Process Study of Electrostatic Torsion Micromirror Based on Au/In Bonding

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(3): 252-257 https://doi.org/10.12450/j.gtdzx.202403012

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