Simulation Study on Reliability of Solder Joints in PoP Package Subjected to Temperature Cycling and Random Vibration Load

PAN Bei, WANG Hongguang, LI Yuxuan, GE Zhenting, CHEN Pengpeng

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (2) : 161-166.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (2) : 161-166. DOI: 10.12450/j.gtdzx.202402011
Microelectronics & Microsystems

Simulation Study on Reliability of Solder Joints in PoP Package Subjected to Temperature Cycling and Random Vibration Load

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(2): 161-166 https://doi.org/10.12450/j.gtdzx.202402011

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