Research on the Au‑In Bonding Technology for 3D Integration

LUAN Huakai, HOU Fang, SUN Chao, WU Yan, YU Miao

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (2) : 157-160.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (2) : 157-160. DOI: 10.12450/j.gtdzx.202402010
Microelectronics & Microsystems

Research on the Au‑In Bonding Technology for 3D Integration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(2): 157-160 https://doi.org/10.12450/j.gtdzx.202402010

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