Research Advance in High‑temperature Lead‑free Electronic Packaging Technology

Research Advance in High‑temperature Lead‑free Electronic Packaging Technology

YU Shuocheng

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (1) : 84-91.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (1) : 84-91. DOI: 10.12450/j.gtdzx.202401015

Device & Material & Technology

Research Advance in High‑temperature Lead‑free Electronic Packaging Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(1): 84-91 https://doi.org/10.12450/j.gtdzx.202401015

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