Design and Implementation of a Chiplet Integrated System‑in‑package Based on I/O High‑speed Bus Architecture

ZHANG Zhuanzhuan, MIAO Min, ZHU Shiliang, Duan Xiaolong

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (1) : 45-49. DOI: 10.12450/j.gtdzx.202401009

Design and Implementation of a Chiplet Integrated System‑in‑package Based on I/O High‑speed Bus Architecture

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(1): 45-49 https://doi.org/10.12450/j.gtdzx.202401009

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