Development of 3 300 V High‑performance Hybrid SiC Module

LIU Yanhong, YANG Xiaofei, WANG Xiaoli, JING Haiyan, LIU Shuang

RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (1) : 13-18.

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RESEARCH & PROGRESS OF SOLID STATE ELECTRONICS ›› 2024, Vol. 44 ›› Issue (1) : 13-18. DOI: 10.12450/j.gtdzx.202401003
Wideband Semiconductor

Development of 3 300 V High‑performance Hybrid SiC Module

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 44(1): 13-18 https://doi.org/10.12450/j.gtdzx.202401003

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