系统封装高速链路中跨层信号通路与配电网络协同分析

李涛^1,2,3, 缪旻^1,2,3

Co⁃analysis of Cross⁃layer Signal Path and Power Distribution Network in High⁃speed Link of System⁃in⁃package

LI Tao^1,2,3, MIAO Min^1,2,3

固体电子学研究与进展 . 2025, (1): 0 . DOI: 10.12450/j.gtdzx.202501008