温度循环和随机振动载荷下堆叠封装焊点可靠性模拟研究
潘碑, 王宏光, 李宇轩, 葛振霆, 陈鹏鹏
Simulation Study on Reliability of Solder Joints in PoP Package Subjected to Temperature Cycling and Random Vibration Load
PAN Bei, WANG Hongguang, LI Yuxuan, GE Zhenting, CHEN Pengpeng
固体电子学研究与进展
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2024, (2): 161
-166
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DOI: 10.12450/j.gtdzx.202402011
