芯粒集成系统封装I/O高速总线架构设计及实现
张转转, 缪旻, 朱仕梁, 段晓龙
Design and Implementation of a Chiplet Integrated System‑in‑package Based on I/O High‑speed Bus Architecture
ZHANG Zhuanzhuan, MIAO Min, ZHU Shiliang, Duan Xiaolong
固体电子学研究与进展
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2024, (1): 45
-49
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DOI: 10.12450/j.gtdzx.202401009
